Injection Molding Process Of Micro Switch

Microswitches are widely used in electronic equipment, instruments and meters, mines, power systems, household appliances, electrical equipment, aerospace, aviation, ships, missiles, tanks and other military fields, such as computer mouse, automobile mouse, automobile electronic products, communication equipment and military products, Testing instruments, gas water heaters, gas stoves, small household appliances, microwave ovens, electric rice cookers, floating ball equipment, medical instruments, building automation, electric tools and general electrical and radio equipment, 24-hour timers, etc.

Microswitch packaging process requirements: rapid packaging, high production efficiency, good waterproof and sealing.

Low pressure injection molding process, low-pressure (1.5 ~ 40bar) low-temperature injection molding. The low-pressure injection molding compound has very good fluidity after heating and melting. When it is injected into the mold, the general temperature is below 100 degrees when it comes into contact with components, and the cooling molding time only takes a few seconds to tens of seconds to demould and obtain the finished product.

Injection molding process is widely used in the packaging of electronic components. It is widely used not only in microswitches and waterproof connectors, but also in the internal connectors of automobile engines. It is resistant to high and low temperatures after molding. It can withstand the high temperature inside the car and protect the components; Good air tightness and excellent waterproof effect.